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Intel Xeon X3460 - BV80605001908AL (BX80605X3460) information

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Type:CPU Manufacturer:Intel
family:Xeon microprocessors:Xeon 3400
Type CPU / Microprocessor
Market segment Server
Family
Intel Xeon 3400
Model number   
X3460
CPU part numbers
  • BV80605001908AL is an OEM/tray microprocessor
  • BX80605X3460 is a boxed microprocessor
Frequency    2800 MHz
Turbo frequency 3467 MHz (1 core)
3333 MHz (2 cores)
2933 MHz (3 or 4 cores)
Bus speed    2.5 GT/s DMI
Clock multiplier    21
Package 1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket Socket 1156 / H1 / LGA1156
Introduction date Sep 8, 2009
End-of-Life date Last order date is December 28, 2012
Last shipment date for tray processors is December 6, 2013
Price at introduction $316
S-spec numbers
  ES/QS processors Production processors
Part number Q3AM SLBJK
BV80605001908AL + +
BX80605X3460   +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Foxhollow-WS
Processor core    Lynnfield
Core stepping    B1 (Q3AM, SLBJK)
CPUIDs 6E5 (Q3AM)
106E5 (SLBJK)
Manufacturing process 0.045 micron
774 million transistors
Die size 296mm2
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size    4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • EM64T / Extended Memory 64 technology / Intel 64   
  • VT-x / Virtualization technology   
  • VT-d / Virtualization for directed I/O
  • NX / XD / Execute disable bit   
  • TBT / Turbo Boost technology   
  • TXT / Trusted Execution technology
  • HT / Hyper-Threading technology   
Low power features
  • Thread C1/C1E, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology   
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes
Other peripherals
  • Direct Media Interface
  • PCI Express 2.0 interface
Electrical / Thermal parameters
V core    0.65V - 1.4V
Maximum operating temperature    72.7°C
Maximum power dissipation    189.78 Watt (peak)
160.08 Watt (sustained)
Thermal Design Power    95 Watt


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